PARLITE® UV Curable Adhesives

PARLITE® UV Glue and UV Adhesive for Electronic Assembly

Back

UV Adhesives and UV Glue are high viscosity encapsulant for precision application to specific electronic assembly areas, glob top application. UV Adhesives are specifically designed for potting. UV Glue bonds with slight adhesion for connectors, thermal switches, temper proofing.

Grade Substrates Viscosity @ 25° C Shore Hardness Elongation Cure Mechanism Tensile Strength Application
4710 Metals, Plastics, Ferrite 17,000 - 20,000 45D 90% UV, Visible or Heat 1,000 psi High viscosity encapsulant for precision application to specific electronic assembly areas, glob top application.
4725 Metals, Ferrite, Plastics 600 - 800 55D 72% UV, Visible or Heat 750 psi Specifically designed for potting. Bonds with slight adhesion: for connectors, thermal switches, temper proofing.
4750 Metals, Ceramic, Glass-filled epoxy 150 - 200 85D 12% UV, Visible and Heat 500 psi Tough, glossy conformal coating with excellent adhesion to wide variety of boards and masks. Fast cure.
4760 Plastics, Glass, Metals 40,000 - 60,000 52D 48% UV, Visible 1,200 psi Potting, Encapsulating, bonding of electronic parts.