Electronic Adhesives

Electronic Adhesives

Electronic Adhesives
Electronic Adhesives PARLITE®

UV Curable Adhesives

Electronic Adhesives
 

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Grade Substrates Viscosity
@ 25° C
Shore
Hardness
Elongation Cure
Mechanism
Tensile
Strength
Application
4710 Metals,
Plastics,
Ferrite
17,000 -
20,000
45D 90% UV, Visible or
Heat
1,000 psi

High viscosity encapsulant for precision application to specific electronic assembly
areas, glob top application.

4725 Metals,
Ferrite,
Plastics
600 - 800 55D 72% UV, Visible or
Heat
750 psi

Specifically designed for potting. Bonds with slight adhesion: for connectors, thermal switches, temper proofing.

4750 Metals, Ceramic,
Glass-filled
epoxy
150 - 200 85D 12% UV, Visible
and Heat
500 psi

Tough, glossy conformal coating with excellent adhesion to wide variety of boards and masks. Fast cure.

4760 Plastics,
Glass, Metals
40,000 -
60,000
52D 48% UV, Visible 1,200 psi

Potting, Encapsulating, bonding of electronic parts.

 

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Electronic Adhesives

Electronic Adhesives